高周疲勞下含短裂紋晶體細觀應力分析
2014-08-07 11:39:40
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朱福先,周金宇,孫奎洲,韓文欽
江蘇理工學院江蘇常州 213001
摘要:采用隨機平面voronoi圖模擬晶體微觀結構,基于有限元方法計算了高周疲勞下含短裂紋晶體細觀應力。研究了短裂紋尖端晶體在不同晶向下的應力狀態,分析了短裂紋的應力強度因子隨晶向的變化規律。對短裂紋穿越晶界的擴展進行了數值模擬,研究分析了短裂紋擴展方向同晶向的變化規律。
關鍵字:高周疲勞;短裂紋;細觀應力;強度因子;晶向
Microscopic Stress Analysis of Crystal with Short Crack under High Cycle Fatigue
ZHU Fuxian, ZHOU Jinyu, SUN Kuizhou, HAN Wenqin
Jiangsu University of Technology, Changzhou 213001 China
Abstract:The microscopic structure of crystal is simulated by the random plane voronoi diagram, and then based on finite element method the microscopic stress of crystal with short crack underhigh cycle fatigue are analyzed. After the study of the crystal stress before the crack tip,variation of stress intensity factors are discussed depending on the grain orientations. The numerical simulation of short crack propagation the through grain boundary is carried out to discuss the variation of the short crack propagating orientation with the grain orientations.
Key words: High cycle fatigue;Short crack;Microscopic stress;Grain orientation
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朱福先:glzhfx@sina.com
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